KARAKTERISTIK PAPAN PARTIKEL TANPA PEREKAT DARI KAYU PULAI (Alstonia scholaris)

Authors

  • Heru Arisandi Program Studi Kimia, Fakultas Teknik, Universitas Bosowa
  • Ridwan Ridwan Program Studi Kimia, Fakultas Teknik, Universitas Bosowa
  • M. Tang Program Studi Kimia, Fakultas Teknik, Universitas Bosowa

Keywords:

Pulai (Alstonia scholaris), particleboard, oxidant, FeSO4

Abstract

Pulai (Alstonia scholaris) is a fast-growing species coming from community forests. Most of the tree parts, namely stem, bark, fruits and roots, have enormous benefits. Especially for the stem, it has the potential to be developed into forest products include particleboard without adhesive. This study aimed to analyze the characteristic properties of the particleboards without adhesive (physical and mechanical properties of the boards) at various levels of oxidants. Particleboards with a size of 30 cm x 30 cm x 0.7 cm and a target density of 0.75 g/cm3 were manufactured through particle activation with H2O2 and FeSO4 at various level of consentration. The board were hot pressed at 180oC with pressure of 25 kg/cm2. Physical and Mechanical properties of boards were evaluated based on Japanese Industrial Standard (JIS) A5908 2003. The results showed that the optimal oxidant consentration of H2O2 and FeSO4 from the parficleboards made was 20% and 5%, respectively, because its physical and mechanical properties fulfilled JIS standard

References

[JSA] Japanese Standards Association, 2003. Particleboards. Japanese Industrial Standar (JIS) A 5908-1993. Japan.

Kementerian Kehutanan. 2013. Statistik Kementerian Kehutanan Tahun 2013. Jakarta Kurniawan R. 2007. Studi Pembuatan Papan

Partikel Binderless dari Inti Kenaf (Hibiscus cannabiouos. L). [Skripsi]. Bogor : Fakultas Kehutanan Institut Pertanian Bogor.

Li K, 2002. Use of Marine Ahesive Protein as a Model to Develop Formaldehyde-Free Wood Adhesives, in Proceeding the 6th Pacific Rim Bio-Based Composites Symposium,. Oregon State University. Oregon USA.

Maloney T M. 1993. Modern Particle Board and Dry Process Fiberboard Manufacturing. Miller Freeman Publications. USA.

Okuda N, K Hori, M Sato, 2005. The Bond Durability of Kenaf Core Binderless Board. Proceeding of International Symposium on Wood Science and Technoloy (Poster Pesentation). Pacifico Yokohama, Japan, November 27-30.

Suhasman, M Y Massijaya, Y S Hadi, dan A Santoso. 2010a. Pengaruh Ukuran Partikel Terhadap Sifat Fisik dan Mekanis Papan Partikel Tanpa Perekat Berbahan Baku Bambu. Di dalam: Nawawi D S et al. Prosiding Seminar Nasional MAPEKI XIII, Bali 10-11 November 2010.

Published

2021-10-16